《半导体科技》杂志介绍

出身名门
　 《半导体科技》创刊于2000年, 是美国PennWell媒体集团具有50多年历史的国际知名品牌《Solid State Technology》和《Advanced Packaging》的中国版，为中国读者提供国内外半导体晶圆制造前后道、封装与测试、以及纳米技术、微机电、平板显示等领域的先进技术信息、最新产品和市场动向。

资源充足
　　《半导体科技》每期内容主要翻译自这些发行已久并获国际认可的优秀品牌，加上我们的编辑人员在全国各地（上海、北京、深圳、香港）及时报导和撰写的本地行业活动和厂商信息等，为中国的晶圆厂、IC设计和封装业内的专业人士提供有用的技术资料。

办刊特色
　　《半导体科技》立足半导体产业，整合全球资源，多角度，全方位报道，为读者和客户提供权威资讯和实用解决方案是我们的专长，配合广泛的发行（9500册）保证我们的读者能及时阅读到有用的行业资料。

SST-AP China magazine

SST-AP China, launched in 2000, is the Chinese version of the world famous Solid State Technology and Advanced Packaging magazines that are with over 50 year history, published by Pennwell in United States. It reports on advanced technologies, new products and market trends in China and Global semiconductor manufacturing, covering on both front end and back end, packaging, testing, nano-technology, microelectronics, flat panel display etc.

With ample of resources, our contents are translated from wide range of well-established and world recognized partnership media. Our local editors are located in the key markets in China - Shanghai, Beijing, Shenzhen, Hong Kong, report on local activities from industry’s vendors, foundries and packaging facilities　in a timely fashion, providing engineers and senior executives in key chip manufacturing, design and packaging facilitates in China the needed technical information on semiconductor fabrication and packaging technologies.

SST-AP China publishes 10 times per year and is circulating to 9,500 readers for each issue.